Product Finder

Search for Amphenol products by Amphenol market or product application by filtering the dropdown below. Click on the product corresponding to your selection(s) to be redirected to the website of that business.

Reset
UltraPort SFP

The UltraPortTM SFP+ interconnect system is comprised of a 20-position hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 32Gbps applications with a backward compatibility for next generation Ethernet and Fibre Channel applications. Amphenol’s UltraPortTM SFP+ connector shares the same exceptional mating interface and EMI cage dimensions as the SFP+ form factor. The cages are built for use with several board thicknesses and assembly processes to accommodate server and switch applications with great cost savings. The connector accepts multiple transceivers per INF-8081 and combines, transmits, and receives functions in a low cost, compact and flexible format. We offer a wide variety of cage configurations, which have a two-piece construction with enhanced transceiver mating tabs available in press-fit or solder tail versions. Stacked versions (2XN) consist of a 2-row cage with integrated connectors. The entire assembly is press-fit pin compliant.

UltraPort SlimSAS

Amphenol’s SlimLine SAS system addresses various interconnect issues in next generation storage devices such as bulk cable form factor restrictions and the introduction of multi lane storage devices. The 8-row, 0.6 mm pitch, 24 Gbps per lane internal solution consumes the same area as the MiniSAS HD 4x solution targeted for next generation SAS-4. The proven high-speed connector and ribbon cable friendly design supports blade and mainstream server designs.

USB Type C Connector System - CMIO

SCALABLE, SUPERSPEED CONNECTOR SYSTEM
USB Type C connectors are expected to be widely used as a next-generation interface. They support a variety of protocols such as USB2.0/3.0/3.1 and meet Superspeed communication 10Gb/s, 5A and 20V power supply.

The usability for USB 3.1 Type C connector is enhanced also by its low profile and reversible product design. It is ideal for emerging product designs.

  • Reversible plug and cable orientation
  • Meets USB 3.1/3.0/2.0 speed performance
  • Supports high speed transmission up to 10Gb/s
  • Extended 5A current rating for USB Power delivery
  • Vertical, right angle and straddle mount configurations and waterproof type available
USB Type-C to DisplayPort Cable Assy

 

Features and Benefits

      1.    Transmission rate: 5.4Gbps

      2.    Transfer Type-C signal to DisplayPort signal

      3.    Compliance with Type-C 1.1 Specification

      4.    Compliance with DP 1.3 Specification

Mechanical Performance

     Mating Force and Un-mating Force

      1. Type-C plug connector

          Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute

          Mating Force: 5N-20N

          Un-mating Force: 8N-20N

 

USB Type-C to RJ45 Dongle

 

Features and Benefits

     1.    Transfer Type-C signal to RJ45 signal

     2.    Compliance with Type-C 1.1 specification

Mechanical Performance

     Mating Force and Un-mating Force

     1. Type-C plug connector

         Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute

         Mating Force: 5N-20N

         Un-mating Force: 8N-20N

     2. RJ45 plug connector

         Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute

         Mating Force: 35 N maximum

         Un-mating Force: 50 N minimum

USB Type-C to Type-C

Features and Benefits

    1.Transmission rate: 10 Gbps.

    2. Meet Type-C 1.0 specification.

Mechanical Performance

    Mating Force and Un-mating Force

    Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

    Mating Force: 5N-20N.

    Un-mating Force: 8N-20N.

Electrical Performance

    1.Contact Resistance 40mohm max for VBUS , GND and all other contacts initial,

       10mohm maximum change after stress test.

    2.Dielectric Withstanding Voltage 100 VAC for 1 minute no breakdown.

    3.Insulation Resistance 100 Mega ohms minimum.

 

USB Type-C to VGA Dongle

 

Features and Benefits

      1.    Transmission rate: 5.4Gbps

      2.    Transfer Type-C signal to VGA signal

      3.    Compliance with Type-C 1.1 Specification

Mechanical Performance

      Mating Force and Un-mating Force

      1. Type-C plug connector

          Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

          Mating Force: 5N-20N

          Un-mating Force: 8N-20N

      2. VGA plug connector

          Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

          Mating Force: 44.1N maximum

          Un-mating Force: 9.8N-39.2N

 

USB2.0 A Plug to SR+OPEN

Features and Benefits 

         1.USB 2.0 transfer rate up to the maximum 480Mbps

         2. Downward compatible with USB1.0/1.1 devices

         3. Provide with both data transmission and charging

         4. Provide blind mate

Mechanical Performance

         1. Mating Force and Unmating Force

             Condition: EIA 364-13, at a max rate of 12.5mm per minute.

             Requirement:

             Mating Force: 35N max.

             Unmating Force: 10N min initial.

         2. Durability

             Condition: EIA 364-09, at a max rate of 500 cycles per hour

         Requirement:

         USB A plug,1500 cycles. No physical damage

 

USB3.0 A Plug to A Plug

 

Features and Benefits

     The Third Generation USB 3.0 maximum data rate of 5Gbps,downward compatible with USB1.0/1.1/2.0.

Mechanical Performance

    1. Mating Force and Unmating Force

        Condition: EIA 364-13, at a max rate of 12.5mm per minute.

        Requirement:

         Mating Force: 35N max.

         Unmating Force: USB-A:10N min initial.

     2. Durability

          Condition: EIA 364-09

          at a max rate of 200 cycles per hour

          Requirement:

         USB 3.0 A plug,1500 cycles. No physical damage

 

USB3.0 A Plug to Micro-B Plug

Features and Benefits

    The Third Generation USB 3.0 maximum data rate of 5Gbps,downward compatible with USB1.0/1.1/2.0.

 

 

Mechanical Performance

    1. Mating Force and Unmating Force

        Condition: EIA 364-13, at a max rate of 12.5mm per minute.

        Requirement:

        Mating Force: 35N max.

        Unmating Force: USB-A:10N min initial, Micro-B: 8N-25N

     2. Durability

        Condition: EIA 364-09 at a max rate of 200 cycles per hour

        Requirement:

        USB 3.0 A plug,1500 cycles. Micro-B plug, 10000 cycles.

        No physical damage

USB3.0 A Plug to Micro-B plug

 

Features and Benefits

     The Third Generation USB 3.0 maximum data rate of 5Gbps,downward compatible with USB1.0/1.1/2.0.

Mechanical Performance

    1. Mating Force and Unmating Force

        Condition: EIA 364-13, at a max rate of 12.5mm per minute.

        Requirement:

         Mating Force: 35N max.

         Unmating Force: USB-A:10N min initial, Micro-B: 8N-25N

     2. Durability

          Condition: EIA 364-09

 at a max rate of 200 cycles per hour

      Requirement:

      USB 3.0 A plug,1500 cycles. Micro-B plug, 10000 cycles.

      No physical damage

Electrical Performance1

     1. Contact Resistance

         30 mΩ (Max) initial for VBUS and GND contacts.

         50 mΩ (Max) initial for all other contacts.

     2. Dielectric Withstanding Voltage 100VAC/min.

        No flashover, no spark over, no excess leakage and no breakdown.

 

XCede IO

The XCede IO interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede IO connector supports next generation 100 G+ applications and transmits up to 28 Gbps per-serial-lane. It features a stamped and formed contact design providing improved mechanical durability and resonance dampening features for superior performance. The design minimizes cross talk and transmission line impedance discontinuity across the connector interface at speeds up to 28 Gbps.

XFP

The XFP interconnect system is capable of a 10 Gbps data rate and is intended for external I/O connections. High speed serial interconnect applications include clusters, servers, and storage devices. Its single row cage configuration requires less space and is a lower cost alternative to parallel-optics VSR. XFP also requires less than one-third the power and physical space of an MSA interconnect with parallel interface. It has a single footprint for all links, and is hot-pluggable.