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ESATA 7P Plug to 7P Receptacle

 

Features and Benefits

      1. Transmission rate 6 Gbps.

      2. Meet SATA 3.0 specification.

Mechanical Performance

      1. Mating Force and Unmating Force

          Condition: EIA 364-13. Insert and extract at a speed of 12.5mm/minute.

          Mating Force: 40 N max.

          Unmating force: 10N Min.

      2. Durability:

          Condition: EIA 364-09. Mated and Unmated connector for 2500cycles at a rate of 500 cycles per hour.

         No physical damage and shall meet requirements of subsequent test.

 

ExpressPort QSFP

The ExpressPort QSFP+/QSFP interconnect system and the stacked combos are comprised of 38-position 0.8mm pitch SMT connectors, as well as press-fit cages intended for external connections. Each port offers 4 channels which increases port density and contributes to cost savings. The ExpressPort QSFP+ E-Series connector family is rated at 28 Gbps per channel. It features as tamped and formed contact design providing improved mechanical durability, an integrated grounding structure,and resonance dampening features for superior crosstalk performance. The contact design is optimized for a smooth impedance profile resulting in improved SI performance.

ExpressPort SFP

Amphenol’s ExpressPort SFP+ 1xN connector, when combined with the ExpressPort SFP+ cage, provides data transfer speeds of up to 25 Gbps. This is the highest speed in the market for the SFP+ series. The design of the ExpressPort SFP+ connector minimizes impedance discontinuities and reflections at high data rates, and provides a 10 to 20 dB improvement in Near-End Cross talk. The connectors accept multiple transceivers per SFF-8431 and are compliant with SFF-8081 and SFF-8083 speci- fications. Our unique ExpressPort SFP+ cage features enhanced EMI shielding options in the form of metal spring fingers or elastomeric gaskets. Ganged versions are compliant with the SFF-8433 standard. The ExpressPort SFP+ 2xN combos consist of an integrated stacked connector system and a cage with compliant press-fit pins or solder tail.

FFC & LIF to VGA + 2X USB3.0 A

 

Features and Benefits

       1. High speed data transmission, such as USB2.0, USB3.0, video and audio

       2. USB signal transmission speed up to 5Gbps

       3. Hybrid FFC with power , differential pair, LED and switch control signal

       4. Easy to assemble with locking latches

       5. Easy to fold and easy routing

       6. Lighter and thinner than copper cable

 

Flat Cable

LF Cable Assemblies

G-PF-59 Precision Push-On Adaptor

The G-PF-59 is a lab-grade, high-performance push-on F-connector adapter. The G-PF-59 has been specifically designed for high-volume testing environments demanding production efficiency, durability and reliability. This adapter utilizes precision specifications, and a special high-cycle, low-tension ground spring, allowing for low insertion force and high volume testing throughput. The G-PF-59 is particularly volume effective with high-density adapter fixtures.  In addition, a high-strength center conductor is used to ensure
high-cycle life expectancy.

•    High-Cycle Life - Exceeds 3,000 Insertions
•    Low Insertion Force for Production Throughput
•    High-Strength Center Conductor Extends Life
•    Chamfered Center Pin for Faster Insertions
•    Durable All-Brass, Nickle-Plated Construction
•    9mm F-Female Barrel Allows Panel Mounting
•    Easy-Grip Knurled Outer Body

DATA SHEET:

Click to Review Data Sheet

 

HD Mini SAS LSE to Mini SAS STR

 

features and Benefits

      1.Transmission rate 12 Gbps.

      2. Meet SAS3.0 specification.

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

+B42 Mating Force: 100 N maximum.

Unmating Force: 50 N maximum.

Electrical Performance

1. Contact Current Rating

     0.5Amperes maximum per pin when mated.

2. Voltage Rating

    30VAC per contact when mated or unmated.

3. Contact Resistance

30mohm max. initial, 15mohm maximum after stress test.

  4. Dielectric Withstanding Voltage

500 VAC for 1 minute no breakdown.

  5. Insulation Resistance

 1000 Mohm minimum.

 

HD Mini SAS STR to Mini SAS STR

 

Features and Benefits

      1.Transmission rate 12 Gbps.

      2. Meet SAS3.0 Rev. 5a specification

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

      Mating Force: 100 N maximum.

      Unmating Force: 50 N maximum. 

Electrical Performance

      1. Contact Current Rating 0.5Amperes maximum per pin when mated.

      2. Voltage Rating 30VAC per contact when mated or unmated.

 

Telaire T9602 Humidity & Temperature Sensor

The Telaire T9602 Humidity & Temperature Sensor is a fully calibrated and temperature compensated Humidity and Temperature Sensor for OEM installations.  Telaire T9602 offers the most advanced and cost effective humidity and temperature sensing solution for virtually any type of application. Based on our own capacitive polymer sensor chip and a CMOS integrated circuit with EEPROM are integrated into an easy mount OEM package.

Features

  • Fully Calibrated & Temperature Compensated
  • Water resistantDigital or Analogue Output
  • Optional wire length
  • Precision & Accuracy (±2% RH, ±0.3°C, 14 bit)
  • Low Current Consumption
  • Reliable in Harsh Environments
  • Different Mounting Options

By Amphenol Advanced Sensors | Telaire

 

 

Telaire MiCS-VZ-89TE Integrated Sensor Module

The Telaire MiCS-VZ-89TE Integrated Sensor Module combines state-of-the-art MOS sensor technology with intelligent detection algorithms to monitor tVOCs and CO2 equivalent variations in confined spaces, e.g. meeting rooms or vehicle cabins.

The dual signal output can be used to control ventilation on-demand, saving energy and reducing cost-of-ownership.

Features

  • Calibration-free
  • Low power
  • Wide VOCs detection range
  • High sensitivity
  • High resistance to shocks and vibrations

By Amphenol Advanced Sensors | Telaire

 

Internal USB3.0 plug to plug

 

Features and Benefits

      The Third Generation:USB 3.0 maximum transfer rate of 5Gbps,downward compatible with USB1.0/1.1/2.0.

Mechanical Performance

      1. Mating Force and Unmating Force

          Condition: EIA 364-13,

          at a max rate of 12.5mm per minute.

          Requirement:

          Mating Force: 35N max.

          Unmating Force:15N min.     

       2. Durability

          Condition: EIA 364-09

          at a max rate of 200 cycles per hour

          Requirement: INTERNAL USB3.0 25 cycles.

       No physical damage

 

Internal USB3.0 to USB3.0 A Female

 

Features and Benefits

        The Third Generation:USB 3.0 maximum transfer rate of 5Gbps,downward compatible with USB1.0/1.1/2.0.

Mechanical Performance

        1. Mating Force and Unmating Force

            Condition: EIA 364-13,

            at a max rate of 12.5mm per minute.

            Requirement:

            Mating Force: 35N max.

            Unmating Force: USB-A:10N min initial,Internal USB3.0:15N min.     

        2. Durability

            Condition: EIA 364-09

            at a max rate of 200 cycles per hour

             Requirement:

             USB 3.0 A FEMALE,1500 cycles. ; INTERNAL USB3.0 25 cycles.

            No physical damage

 

Enclosures

The Infinity Premises, IPE series enclosures were designed with the technician in mind.  Completely reimagined using the real world needs for technicians and installers, the IPE series completes the Infinity Premises System, integrating installation hardware to work as a system.  The QuicMount Rail allows passive and active devices to snap in without hardware.  Cable Retention Slots allow installation to occur outside of the enclosure and simply slide into place.  Continuous Bosses, modular accessories, weather and UV resistant materials are just a few more of the ground breaking innovations designed into the IPE Enclosure Series.  

SM-UART-01L Laser Dust Senso

The Telaire SM-UART-01L Laser Dust Sensor detects dust particle concentration in air by using an optical sensing method consisting of a laser light emitting diode (LED) and a photo sensor that are optically-arranged in the device. The photo sensor detects the reflected laser LED light by dust particles in air. The dust sensor can detect small particles, such as cigarette smoke, and distinguish small particles, such as smoke from large house dust, by the pulse pattern of the signal output.

 

Features

  • Fast Response
  • High Accuracy
  • Digital UART Output
  • Ultra-Compact Size

 

By Amphenol Advanced Sensors | Telaire

 

 

Leap® On-Board Transceiver - Optical

SMALL, FAST AND POWER EFFICIENT
Amphenol ICC's 300Gb/s Leap® High-Speed Optical Module is faster, smaller, more cost and power efficient than most conventional datacenter interconnects.

  • Capable of speeds up to 25Gb/s and distances up to 100m
  • 300Gb/s total throughput requires only 1sq inch of board space and 5.4W of power
  • Optical cable can be routed above around other components in the design
MezzoStak Mezzanine Connector

Robust 0.5mm fine pitch mezzanine connector suitable for a wide range of high reliability applications and demanding environments.

Innovative hermaphroditic design provides a precise mating interface with extra housing guidance.

Reduced product mix simplifies customer connector qualification, documentation and maintenance.

Two versions offer a choice between supplemental PCB hold-downs and pegs for short overall length.

Micro USB 3.0

The Micro USB 3.0 connector is a smaller version of the Mini USB 2.0 connector. The connector features SuperSpeed, a new transfer mode that enables data transfer rates up to 5Gb/s, which is a ten times increase in performance over its predecessor. The connector also features high durability, allowing over 10,000 insertion cycles.

Amphenol ICC offers Micro USB 3.0 Type B receptacle in surface mount style, header and cable solutions. The full metal shield offers protection from electromagnetic interference and electrostatic discharge.

The specification of the Micro USB 3.0 supports the current USB On-The-Go (OTG) supplement and provides total mobile interconnectivity. It enables communications between portable devices without the need for a host computer. It also allows convenient recharging and power supply between computers and electronic devices, thereby replacing the need for adapters and power chargers.

Micro USB 3.0 connectors are ideal for applications in telecom, datacom, consumer electronics devices and industrial markets.

Mini DP to Mini DP

 

Features and Benefits

       1. Higher performance than dual link DVI, total data rate 10.8Gbps

       2. Available audio and video for multi-function monitors

       3. Embedded clock

       4. Connector enables support for DVI and HDMI via simple adapter

       5. Enables new “Direct Drive” monitor category

       6. Enable greater integration on both sides of the interface to reduce the cost of digital displays

       7. Provide scalable performance in terms of resolution, color depth, and refresh rate over fewer wires to support emerging  display needs, such as scalable lanes (1-4) for direct drive LCD panel integration

       8. Auxiliary channel(1Mbps) enables new user featuresfor example as transfer channel of voice chatter, VoIP, game control and camera video

       9. Available content protection supports high definition movie viewing

       10. Enable a common interface approach across both internal and external display connections

       11. Enable an extensible, open industry standard without IP (intellectual property) barriers

       12. Offer max 3m cable at high bit rate 2.7GHz and max 15m cable at low bit rate 1.62GHz

 

Mini SAS 36P STR to RA

 

Features and Benefits

      1.Transmission rate 12 Gbps.

      2. Meet SAS3.0 specification.

Mechanical Performance

     Mating Force and Unmating Force

     Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

     Mating Force: 55 N maximum.

     Unmating Force: 49 N maximum.

Electrical Performance

     1.Contact Current Rating 0.5Amperes maximum per pin when mated.

     2.Voltage Rating  30VAC per contact when mated or unmated.

 

MiniSAS

The Mini-SAS external I/O connector system consists of a die-cast metal cage and a Compact Multi Lane SMT connector. The Mini-SAS can support Fiber Channel and Infini-Band standards, making it the perfect solution to the ever-growing demand of high-speed mass storage systems, servers, and storage area networks. Providing four serial send/receive channels per port, this connector system provides signal speeds of 6 Gbps per channel across the connector interface and is designed to satisfy the needs for gigabit serial data transmission applications. The connector satisfies the requirements of the INCITS T10 SAS 2.0 and SAS 2.1, and is also compliant with SFF-8086 and SFF-8088. The cage is mounted separately to the body so that the stress imposed by insertion and removal of the cable plug does not affect the signal/body solder joints. The connector is available with unique solder hold-down tabs designed to provide additional mechanical robustness in demanding applications.

MiniSAS HD

The Mini-SAS High Density Interconnect is the next generation SAS system, with 4x, 8x and 16x cable-plugging options to provide faster data transmission and more bandwidth for end users. Our Mini-SAS HD is designed to be compliant with the SFF-8644 standard. It is also designed to save space with its increased density and reduced size as compared to the Mini-SAS 2.0. The Mini-SAS HD connector system has a 2-row, right angle connector with 12 Gbps per channel. Each connector handles 4 lanes of data for up to 48 Gbps of total bandwidth. Ganged options are also available up to a 1x4 configuration for up to 192 Gbps of total bandwidth. This connector will mate with active copper and optical cable assemblies, as well as active pluggable modules for extended-length applications in data centers. Main applications for Mini-SAS HD include HBA Servers, storage devices, and switches in data centers.

Minitek127® 1.27mm pitch Connector

Minitek127® is an extensive modular range of connectors for all types of wire to board and cable to board applications. It includes straight and right angle, surface mount and through mount, pin headers and board receptacles in different plating variations and position numbers up to 100. The product line also include IDC version.

Minitek® Pwr 3.0 High Current Connector

ROBUST, VERSATILE AND HIGH CURRENT PERFORMANCE

Minitek® Pwr 3.0 High Current Connector (HCC) is designed for power applications with current rating up to 12A per contact and wire gauge range from 20 to 16AWG for Wire-to-Wire and Wire-to-Board applications. It is available in 2 to 24 circuits for dual row.

Rated current up to 12A per contact

Fully isolated terminals

High retention force in housing

Fully polarized housing

Minitek® Pwr 4.2 High Current Connector

ROBUST, VERSATILE AND HIGH CURRENT PERFORMANCE

Minitek® Pwr 4.2 High Current Connector (HCC) is designed for power applications with current rating up to 13.5A per contact and wire gauge range from 20 to 16AWG for Wire-to-Wire and Wire-to-Board applications. It is available in 2 to 24 circuits for dual row and 3 to 5 circuits for single row.

Rated current up to 13.5A per contact

Fully isolated terminals

Positive locking on housing with low thumb latch operation

Patented right angle receptacle housing.

Minitek® Pwr Hybrid 3.0

Minitek® Pwr Hybrid 3.0 connectors are designed for power and signal application with current rating up to 5A per circuit, available for dual row and 2 to 24 power circuits, and 2 to 12 signal for Wire-to-Board application.

Crimp, snap-in receptacle contacts are used to terminate AWG 20-30 wires. Receptacle housings allow Wire-to-Board configurations. Crimping and removal tools are available for wire harness assembly. Board mounted vertical header supports Wire-to-Board interconnections. Wave soldering headers are available in through-hole configuration.

Minitek® Pwr Hybrid 4.2

Minitek® Pwr Hybrid 4.2 connectors are designed for power and signal application with current rating up to 9A per circuit, available for dual row and 2 to 24 power circuits, and 2 to 12 signal for Wire-to-Board application.

Crimp, snap-in receptacle contacts are used to terminate AWG 16-30 wires. Receptacle housings allow Wire to-Board configurations. Crimping and removal tools are available for wire harness assembly. Board mounted vertical headers support Wire-to-Board interconnections. Wave soldering headers are available in through-hole configuration.

6mm carbon potentiometer.

6mm low cost carbon potentiometer. For long life and lead free reflow soldering please use the product N6R.

Standard features:
  • RoHS compliant materials.
  • Carbon resistive element.
  • Plastic substrate.
  • Over-moulding manufacturing technique.
  • SMD or through hole.
  • Embossed Tape (for SMD), tape on reel, ammopack and magazine packaging for automatic insertion and bulk for manual assembly.
  • Both sides cross slot easy adjustment.
  • Accidental rotor movement protected.
  • Traceability insured through date code marking.
  • Assembly method: stand up and lay down.

More information.

Miniature potentiometer.

The N6R is a unique, fully RoHS ready miniture potentiometer with all the features of the traditional full size types. The combination of the 10k mechanical life, reduced form factor, RoHS reflow compatibility and overmoulding technology provides market leading performance in a compact, robust design. 

The N6R Long Life "E" version has been conceived for the appliance and automotive industries to provide a cost effective solution. Further options include improved linearity, a 360º endless rotation option and a selection of shafts and knobs. Ask for double reflow potentiometers and geared potentiometers here.

More information.

Linear position sensor

Features: 

  •  High reliability.
  •  Simple construction (only 3 component parts).
  •  Over-moulding manufacturing technique.
  •  Plastic or metal clip versions available.
  •  Various fixation means: clip type (inward/outward actuating), locating pins,...

Provides a low cost, highly reliable solution for all position sensing applications: automotive seat position memory, central locking, headlamp position and rear-view mirror position sensors.

More information.

OSFP

The OSFP interconnect system has 60 contacts per port and supports 16 high speed pairs. With a 0.6mm contact pitch, 4 rows of contacts and a horizontal port pitch of 23.38mm, the OSFP footprint is optimized for signal integrity performance. The stacked connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications. An integrated heat sink for optimal thermal performance is a feature of the design.