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Slim SATA to SATA+Power

 

Features and Benefits

      1. Transmission rate 6 Gbps.

      2. Meet SATA 3.0 specification.

Mechanical Performance

      1. Mating Force and Unmating Force

          Condition: EIA 364-13. Insert and extract at a speed of 12.5mm/minute.

          Mating Force: 45 N max.

          Unmating force: 10N Min.

      2. Durability:

          Condition: EIA 364-09. Mated and Unmated connector for 50cycles at a rate of 200 cycles per hour.

          No physical damage and shall meet requirements of subsequent test. 

   

SlimSAS 4i Straight to Straight

 

Features and Benefits

      1. Smaller size connector and cable saves device space

      2. Provide four channels signal transmission as per industry standard

      3. Data speed: 24Gbps for SAS and 8GT/s for PCIe per channel

      4. Meet SAS4.0 and Ultraport SlimSAS SFF-8654 specification

Mechanical Performance

      1. Retention Force: 50N minimum

      2. Rated durability cycles: 50 cycles minimum

Electrical Performance

      1. Voltage: 30VDC per contact 30mohm max. initial, 15mohm maximum after stress test.

      2.Dielectric Withstanding Voltage: 250 VDC minimum for 100 ms

      3. Insulation Resistance: 100 MΩ minimum between adjacent terminal

 

Thermometrics NTC Thermistors Surface Mount Devices (SMD)

Thermometrics NTC Type Surface Mount Devices (SMD) are intended for temperature measurement, control and compensation. They are suitable for standard soldering techniques and availabe in a range of sizes, including 0402, 0603, 0805 and 1206.

By Amphenol Advanced Sensors | Thermometrics, Inc.

Features:

  • Nickel barrier tin-plated terminations for soldering
  • High sensitivity to changes in temperature
  • Wide operating temperature range -40°C to 125°C
  • Rugged construction
  • Excellent solderability without “tombstoning”
  • Glass-coated ceramic between electrodes for improved stability
  • Supplied in tape-and-reel packaging
  • Available in other material systems

 

UltraPort QSFP

The UltraPort QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The UltraPort QSFP+ connector supports next generation 100 G+ applications and transmits up to 32 Gbps per-serial-lane making it the fastest connector in the QSFP+ market. It features a stamped and formed contact design providing improved mechanical durability and resonance dampening features for superior performance. The design minimizes cross talk and transmission line impedance discontinuity across the connector interface at speeds up to 32 Gbps.

UltraPort SFP

The UltraPortTM SFP+ interconnect system is comprised of a 20-position hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 32Gbps applications with a backward compatibility for next generation Ethernet and Fibre Channel applications. Amphenol’s UltraPortTM SFP+ connector shares the same exceptional mating interface and EMI cage dimensions as the SFP+ form factor. The cages are built for use with several board thicknesses and assembly processes to accommodate server and switch applications with great cost savings. The connector accepts multiple transceivers per INF-8081 and combines, transmits, and receives functions in a low cost, compact and flexible format. We offer a wide variety of cage configurations, which have a two-piece construction with enhanced transceiver mating tabs available in press-fit or solder tail versions. Stacked versions (2XN) consist of a 2-row cage with integrated connectors. The entire assembly is press-fit pin compliant.

UltraPort SlimSAS

Amphenol’s SlimLine SAS system addresses various interconnect issues in next generation storage devices such as bulk cable form factor restrictions and the introduction of multi lane storage devices. The 8-row, 0.6 mm pitch, 24 Gbps per lane internal solution consumes the same area as the MiniSAS HD 4x solution targeted for next generation SAS-4. The proven high-speed connector and ribbon cable friendly design supports blade and mainstream server designs.

USB Type C Connector System - CMIO

SCALABLE, SUPERSPEED CONNECTOR SYSTEM
USB Type C connectors are expected to be widely used as a next-generation interface. They support a variety of protocols such as USB2.0/3.0/3.1 and meet Superspeed communication 10Gb/s, 5A and 20V power supply.

The usability for USB 3.1 Type C connector is enhanced also by its low profile and reversible product design. It is ideal for emerging product designs.

  • Reversible plug and cable orientation
  • Meets USB 3.1/3.0/2.0 speed performance
  • Supports high speed transmission up to 10Gb/s
  • Extended 5A current rating for USB Power delivery
  • Vertical, right angle and straddle mount configurations and waterproof type available
USB2.0 A Plug to SR+OPEN

Features and Benefits 

         1.USB 2.0 transfer rate up to the maximum 480Mbps

         2. Downward compatible with USB1.0/1.1 devices

         3. Provide with both data transmission and charging

         4. Provide blind mate

Mechanical Performance

         1. Mating Force and Unmating Force

             Condition: EIA 364-13, at a max rate of 12.5mm per minute.

             Requirement:

             Mating Force: 35N max.

             Unmating Force: 10N min initial.

         2. Durability

             Condition: EIA 364-09, at a max rate of 500 cycles per hour

         Requirement:

         USB A plug,1500 cycles. No physical damage

 

USB3.0 A Plug to A Plug

 

Features and Benefits

     The Third Generation USB 3.0 maximum data rate of 5Gbps,downward compatible with USB1.0/1.1/2.0.

Mechanical Performance

    1. Mating Force and Unmating Force

        Condition: EIA 364-13, at a max rate of 12.5mm per minute.

        Requirement:

         Mating Force: 35N max.

         Unmating Force: USB-A:10N min initial.

     2. Durability

          Condition: EIA 364-09

          at a max rate of 200 cycles per hour

          Requirement:

         USB 3.0 A plug,1500 cycles. No physical damage

 

Waterproof IP68 Temperature Sensors

The Thermometrics Waterproof IP68 Temperature Sensors include Types JI and JIC NTC Thermistors. Both types are molded onto a flexible circular cable. The tip and outer cable insulation material is thermoplastic elastomer rubber. The tinned copper conductors have individual polypropylene insulation. Type JIC offers the option of a stainless steel housing.

 

Features

  • Waterproof to IP68
  • Withstands freeze/thaw cycling
  • Range of wire lengths from 300-5000mm (11.8 in-16.4 ft)
  • Halogen-free cable
  • Sensor tip and extension cable moulded together as one hot vulcanised unit
  • RoHS compliant

 

By Amphenol Advanced Sensors | Thermometrics, Inc.                 

 

XCede IO

The XCede IO interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede IO connector supports next generation 100 G+ applications and transmits up to 28 Gbps per-serial-lane. It features a stamped and formed contact design providing improved mechanical durability and resonance dampening features for superior performance. The design minimizes cross talk and transmission line impedance discontinuity across the connector interface at speeds up to 28 Gbps.

XFP

The XFP interconnect system is capable of a 10 Gbps data rate and is intended for external I/O connections. High speed serial interconnect applications include clusters, servers, and storage devices. Its single row cage configuration requires less space and is a lower cost alternative to parallel-optics VSR. XFP also requires less than one-third the power and physical space of an MSA interconnect with parallel interface. It has a single footprint for all links, and is hot-pluggable.