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HCI® High Power Connector -Basics

The HCI® High Power backplane/midplane connector series addresses applications demanding additional power at the interface between a daughter card and a backplane or midplane in chassis-based equipment platforms. The compact modules leverage proven, cost-effective stamped-andformed HCI power contact technology to provide increased linear power density along the daughter card edge. In addition to conventional 1x2 and 1x3 power contact configurations, a 2-position module is available with an integrated guide between the power contacts.

HCI High Power modules are rated for up to 113A per contact without exceeding a 30°C temperature rise in still air. The modules address applications where current density requirements extend beyond those of Amphenol ICC's established Hard Metric High Power Connector System.

These stand-alone modules are designed for use alongside other Hard Metric (HM) backplane/midplane connector families such as Amphenol ICC's high-performance AirMax VS® and ZipLine™ connector systems or Millipacs® 2mm HM connectors. In fact, ZipLine and HCI High Power together offer the highest combination of signal and power density in the marketplace.

Individual power contacts are surrounded on four sides by molded housing walls to provide a distinct safety feature that prevents adjacent power contacts from shorting. The touchproof housings are designed to optimize airflow around and through the connector by providing vents above and below the power contacts as well as along the rear of the housing. A 2x2 right-angle receptacle extends use to co-planar applications when used with a 1x2 or 2x2 right-angle header.

HD Mini SAS 36P to 4X SATA 7P

 

Features and Benefits

      1. Transmission rate 6 Gbps.

      2. Meet SAS2.1 specification.

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

      Mating Force: 100 N maximum for HD Mini SAS connector.

      Unmating Force: 50 N maximum for HD Mini SAS connector..

      Mating Force: 45 N maximum for SATA connector.

      Unmating Force: 10 N maximum for SATA connector.

Electrical Performance

      1.Contact Current Rating 0.5Amperes maximum per pin when mated.

      2.Voltage Rating 30VAC per contact when mated or unmated.

      3.Contact Resistance 30mohm max. initial, 15mohm maximum after stress test.

 

HD Mini SAS 36P to SAS 22P+Power

 

Features and Benefits

      1. Transmission rate 12 Gbps.

      2. Meet SAS3.0 specification.

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

      Mating Force: 100 N maximum for HD Mini SAS connector.

      Unmating Force: 50 N maximum for HD Mini SAS connector..

      Mating Force: 50N maximum for SAS connector.

       Unmating Force: 20N maximum for SAS connector.

 

HD Mini SAS 72P STR to 72P STR

 

Features and Benefits

      1.Transmission rate 12 Gbps.

      2. Meet SAS3.0 specification.

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

      Mating Force: 100 N maximum.

      Unmating Force: 50 N minimum.

Electrical Performance

      1. Contact Current Rating 0.5Amperes maximum per pin when mated.

      2. Voltage Rating 30VAC per contact when mated or unmated.

      3. Contact Resistance 30mohm max. initial, 15mohm maximum after stress test.

 

HD Mini SAS LSE to Mini SAS STR

 

features and Benefits

      1.Transmission rate 12 Gbps.

      2. Meet SAS3.0 specification.

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

+B42 Mating Force: 100 N maximum.

Unmating Force: 50 N maximum.

Electrical Performance

1. Contact Current Rating

     0.5Amperes maximum per pin when mated.

2. Voltage Rating

    30VAC per contact when mated or unmated.

3. Contact Resistance

30mohm max. initial, 15mohm maximum after stress test.

  4. Dielectric Withstanding Voltage

500 VAC for 1 minute no breakdown.

  5. Insulation Resistance

 1000 Mohm minimum.

 

HD Mini SAS STR to Mini SAS STR

 

Features and Benefits

      1.Transmission rate 12 Gbps.

      2. Meet SAS3.0 Rev. 5a specification

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

      Mating Force: 100 N maximum.

      Unmating Force: 50 N maximum. 

Electrical Performance

      1. Contact Current Rating 0.5Amperes maximum per pin when mated.

      2. Voltage Rating 30VAC per contact when mated or unmated.

 

HPCE® Board To Board Connector - Basics

The HPCE® BTB is a board to board high power connector for demanding applications requiring high linear current density and small connector size. It is part of Amphenol ICC's HPCE® series family together with HPCE and HPCE cable assembly.

The HPCE® BTB incorporates an innovative power contact and housing design that permits a more compact and lower profile package for demanding AC and DC power distribution applications. Both header and receptacle have an extremely low profile height (7.5mm) and are based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power connectors from Amphenol ICC. The low contact resistance (Power: 0.6 m Ω max.) also greatly reduces power loss in the transmission.

HPCE® BTB is ideal for next generation 1U/2U servers, storage enclosures, telecommunications equipment and datacom/ networking equipment.

HPCE® Cable Assembly Connectors

The HPCE® cable assembly is a next-generation power cable assembly for demanding applications requiring high linear current density and low power loss. It offers both one-piece (cable to card edge) and two-piece (cable to header) solutions. Both have a low profile height (7.5mm) and are based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from Amphenol ICC.

The HPCE® cable assembly incorporates an innovative power contact and housing design that permits a more compact and lower profile package for demanding AC and DC power distribution applications. HPCE® cable assembly offers low profile height (for maximized airflow), significantly increased linear current density and low contact resistance characteristics make it ideal for next generation 1U/2U servers, storage enclosures, telecommunications equipment and datacom/networking equipment.

HS VHDCI

High Speed Cables

Thermometrics CL Series of Inrush Current Limiting Thermistors

Thermometrics CL Series of Inrush Current Limiting Thermistors consist of a disc thermistor with uninsulated lead-wires, and are used to control inrush current when switching power supplies. The main purpose of limiting inrush current is to prevent components in series with the input to the DC/DC convertor from being damaged. Typically, inrush protection prevents nuisance blowing of fuses or breakers as well as welding of switch contacts.

 

By Amphenol Advanced Sensors | Thermometrics, Inc.

 

Features:

  • Low cost, solid state device for inrush current suppression
  • Excellent mechanical strength
  • Wide operating temperature range: -58°F to 347°F (-50°C to 175°C)
  • Suitable for PCB mounting
  • Available as a standard with kinked or straight leads and on tape and reel to EIS RS-468A for automatic insertion
  • Low steady resistance and accompanying power loss
  • Small size
  • Low cost solid state sensor
Internal USB3.0 plug to plug

 

Features and Benefits

      The Third Generation:USB 3.0 maximum transfer rate of 5Gbps,downward compatible with USB1.0/1.1/2.0.

Mechanical Performance

      1. Mating Force and Unmating Force

          Condition: EIA 364-13,

          at a max rate of 12.5mm per minute.

          Requirement:

          Mating Force: 35N max.

          Unmating Force:15N min.     

       2. Durability

          Condition: EIA 364-09

          at a max rate of 200 cycles per hour

          Requirement: INTERNAL USB3.0 25 cycles.

       No physical damage

 

Internal USB3.0 to USB3.0 A Female

 

Features and Benefits

        The Third Generation:USB 3.0 maximum transfer rate of 5Gbps,downward compatible with USB1.0/1.1/2.0.

Mechanical Performance

        1. Mating Force and Unmating Force

            Condition: EIA 364-13,

            at a max rate of 12.5mm per minute.

            Requirement:

            Mating Force: 35N max.

            Unmating Force: USB-A:10N min initial,Internal USB3.0:15N min.     

        2. Durability

            Condition: EIA 364-09

            at a max rate of 200 cycles per hour

             Requirement:

             USB 3.0 A FEMALE,1500 cycles. ; INTERNAL USB3.0 25 cycles.

            No physical damage

 

Latch N Lok Crimp Connectors

Amphenol ICC's Latch-N-Lok Connector Family is a shielded, latching input/output connector system with PCB receptacles and cable plug kits for signals including intermediate speed and power. The family includes a convenient latching feature that has an audible 'click' when it is properly attached. The 'clicking' latch signals proper mating and gives customers confidence that their I-O is ready to function properly.

Leap® On-Board Transceiver - Optical

SMALL, FAST AND POWER EFFICIENT
Amphenol ICC's 300Gb/s Leap® High-Speed Optical Module is faster, smaller, more cost and power efficient than most conventional datacenter interconnects.

  • Capable of speeds up to 25Gb/s and distances up to 100m
  • 300Gb/s total throughput requires only 1sq inch of board space and 5.4W of power
  • Optical cable can be routed above around other components in the design
Metral® Board Connectors - Basics

Metral® product family offers the widest range of backplane connector solutions which includes right angle and vertical for both header and receptacle series. The connectors are designed in accordance with IEC 61076-4-104 and Telcordia GR-1217- CORE.

Metral® headers and receptacles offer high contact density of 250 contacts per 100mm connector length and a contact pitch of 2mm. They are available in 4 and 5 row versions.

Metral® vertical receptacles can be used with vertical headers for mezzanine application.

Metral® backplane connectors meet Futurebus+ standards to support applications in data, industrial and instrumentation, medical and telecom markets.

Metral® High Speed 4000 Series Connectors

Amphenol ICC's Metral® 4000 Series is a high speed 2mm backplane connector system consisting of Right-Angle receptacles and vertical headers. The 4000 Series features a unique stripline structure in both the receptacle and header. Compared to the Metral® 1000 and 2000 Series, Metral® 4000 receptacle connectors employ a modified receptacle contact geometry optimized for 100Ωm differential signals.

This yields a better impedance match and lower insertion loss. Metral® 4000 headers and receptacles also use a press-fit pin designed for 0.6mm drilled holes. The reduced hole diameter frees additional board space for trace routing and also results in lower capacitance.

The Metral® 4000 Series is available in a 5x6 module size. In addition to having ground shields between columns, the 5-row connectors use the third row for ground connections.Aside from the design enhancements to extend high-speed electrical performance up to 6.25 Gb/s, Metral® 4000 Series connectors are similar to the Amphenol ICC Standard Metral® Connectors. The system is designed to conveniently stack end-to-end with other Amphenol ICC Metral® products.

MezzoStak Mezzanine Connector

Robust 0.5mm fine pitch mezzanine connector suitable for a wide range of high reliability applications and demanding environments.

Innovative hermaphroditic design provides a precise mating interface with extra housing guidance.

Reduced product mix simplifies customer connector qualification, documentation and maintenance.

Two versions offer a choice between supplemental PCB hold-downs and pegs for short overall length.

Micro SATA to SATA+Power

 

Features and Benefits

     1. Transmission rate 6 Gbps.

     2. Meet SATA 3.0 specification.

Mechanical Performance

     1. Mating Force and Unmating Force

         Condition: EIA 364-13. Insert and extract at a speed of 12.5mm/minute.

         Mating Force: 45 N max

         Unmating Force: 10 N min for cycles 1 through 5. 8N min after 50 mating/unmating (at rate of 200cycles per hour) cycles.

     2. Durability:Condition: EIA 364-09. Mated and Unmated connector for 50cycles at a rate of 200 cycles per hour.

         No physical damage and shall meet requirements of subsequent test.

Electrical Performance

      1. Contact Resistance

          Condition: EIA 364-23. Subject mated contacts assembled in housing to 20mV max Open circuit at 100mA maximum.

          30 mohm max, initial per contact mated pair. 15 mohm maxi, after stress per contact mated pair.

      2. Dielectric Withstanding Voltage

           No flashover, no spark over, no excess leakage and no breakdown.

     3. Insulation Resistance

         Condition: EIA 364-21. Method C. Measure the insulation resistance between the adjacent contacts of mated and unmated connector assemblies.

          The IR shall be 1000 Mohm minimum.

Micro USB 3.0

The Micro USB 3.0 connector is a smaller version of the Mini USB 2.0 connector. The connector features SuperSpeed, a new transfer mode that enables data transfer rates up to 5Gb/s, which is a ten times increase in performance over its predecessor. The connector also features high durability, allowing over 10,000 insertion cycles.

Amphenol ICC offers Micro USB 3.0 Type B receptacle in surface mount style, header and cable solutions. The full metal shield offers protection from electromagnetic interference and electrostatic discharge.

The specification of the Micro USB 3.0 supports the current USB On-The-Go (OTG) supplement and provides total mobile interconnectivity. It enables communications between portable devices without the need for a host computer. It also allows convenient recharging and power supply between computers and electronic devices, thereby replacing the need for adapters and power chargers.

Micro USB 3.0 connectors are ideal for applications in telecom, datacom, consumer electronics devices and industrial markets.

Millipacs® Compact PCI Connectors

Millipacs® 2.00mm Hard Metric connectors fulfills the interconnection requirement of the Compact PCI bus architecture.

Compact PCI Millipacs® connectors are designed in accordance to IEC 61076-4-101.

Millipacs® Hard Metric Connectors covers the entire range of 2mm connectors required by Compact PCI Board. Vertical headers, right angle receptacles, back panel shrouds and color coding keys are offered.

Mini SAS 36P RA to RA

 

Features and Benefits

      1.Transmission rate 12 Gbps.

      2. Meet SAS3.0 specification.

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

      Mating Force: 55 N maximum.

      Unmating Force: 49 N maximum.

Electrical Performance

      1. Contact Current Rating 0.5Amperes maximum per pin when mated.

      2. Voltage Ratin  30VAC per contact when mated or unmated.

      3.Contact Resistance 30mohm max. initial, 15mohm maximum after stress test.

      4  Dielectric Withstanding Voltage 500 VAC for 1 minute no breakdown.

      5 .Insulation Resistance 1000 Mohm minimum.

 

Mini SAS 36P Reverse RA to RA

 

Features and Benefits

      1.Transmission rate 12 Gbps.

      2. Meet SAS3.0 specification.

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

      Mating Force: 55 N maximum.

       Unmating Force: 49 N maximum.

Electrical Performance

      1.Contact Current Rating 0.5Amperes maximum per pin when mated.

      2.Voltage Rating 30VAC per contact when mated or unmated.

      3.Contact Resistance 30mohm max. initial, 15mohm maximum after stress test.

 

Mini SAS 36P SE to SE

 

Features and Benefits

      1.Transmission rate 12 Gbps.

      2. Meet SAS3.0 specification.

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

      Mating Force: 55 N maximum.

      Unmating Force: 49 N maximum.

Electrical Performance

      1. Contact Current Rating 0.5Amperes maximum per pin when mated.

      2. Voltage Rating 30VAC per contact when mated or unmated.

      3.Contact Resistance  30mohm max. initial, 15mohm maximum after stress test.

 

Mini SAS 36P STR to RA

 

Features and Benefits

      1.Transmission rate 12 Gbps.

      2. Meet SAS3.0 specification.

Mechanical Performance

     Mating Force and Unmating Force

     Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

     Mating Force: 55 N maximum.

     Unmating Force: 49 N maximum.

Electrical Performance

     1.Contact Current Rating 0.5Amperes maximum per pin when mated.

     2.Voltage Rating  30VAC per contact when mated or unmated.

 

Mini SAS 36P STR to SAS 22P STR+Power

 

Features and Benefits

      1.Transmission rate 12 Gbps.

      2. Meet SAS3.0 specification.

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

      Mating Force: 55 N maximum.

      Unmating Force: 49 N maximum.

Electrical Performance

      1.Contact Current Rating 0.5Amperes maximum per pin when mated.

      2.Voltage Rating 30VAC per contact when mated or unmated.

      3.Contact Resistance 30mohm max. initial, 15mohm maximum after stress test.

 

Mini SAS 36P STR to SATA 7P

 

Features and Benefits

      1.Transmission rate 6.0 Gbps.

      2. Meet SAS2.1 specification.

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

      Mating Force: 55 N maximum for Mini SAS.

      Unmating Force: 49 N maximum for Mini SAS.

      Mating Force: 45 N maximum for SATA connector.

      Unmating Force: 10 N maximum for SATA connector.

Electrical Performance

      1.Contact Current Rating 0.5Amperes maximum per pin when mated.

      2.Voltage Rating 30VAC per contact when mated or unmated.

      3.Contact Resistance 30mohm max. initial, 15mohm maximum after stress test.

 

Mini SAS 36P STR to STR

 

Features and Benefits

      1.Transmission rate 12 Gbps.

      2. Meet SAS3.0 specification.

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

      Mating Force: 55 N maximum.

      Unmating Force: 49 N maximum.

Electrical Performance

      1.Contact Current Rating  0.5Amperes maximum per pin when mated.

      2.Voltage Rating  30VAC per contact when mated or unmated.

     3.Contact Resistance 30mohm max. initial, 15mohm maximum after stress test.

     4.Dielectric Withstanding Voltage  500 VAC for 1 minute no breakdown.

     5.Insulation Resistance 1000 Mohm minimum.

 

Mini SAS 68P RA to 68P RA

 

Features and Benefits

      1. Transmission rate 12 Gbps.

      2. Meet SAS3.0 specification.

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

      Mating Force: 55 N maximum.

      Unmating Force: 49 N maximum.

Electrical Performance

      1.Contact Current Rating 0.5Amperes maximum per pin when mated.

      2.Voltage Rating 30VAC per contact when mated or unmated.

      3.Contact Resistance 30mohm max. initial, 15mohm maximum after stress test.

 

Mini SAS 68P STR to 2 X Mini SAS 36P Left SE

 

Features and Benefits

      1.Transmission rate 12 Gbps.

      2.Meet SAS3.0 specification.

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

      Mating Force: 55 N maximum.

      Unmating Force: 49 N maximum.

Electrical Performance

      1.Contact Current Rating

          0.5Amperes maximum per pin when mated.

     2. Voltage Rating

        30VAC per contact when mated or unmated.

     3.Contact Resistance

        30mohm max. initial, 15mohm maximum after stress test.

     4  Dielectric Withstanding Voltage

        500 VAC for 1 minute no breakdown.

     5 .Insulation Resistance

        1000 Mohm minimum.

 

Mini SAS 68P STR to 68P STR

 

Features and Benefits

      1. Transmission rate 12 Gbps.

      2. Meet SAS3.0 specification.

Mechanical Performance

      Mating Force and Unmating Force

      Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

      Mating Force: 55 N maximum.

      Unmating Force: 49 N maximum.

Electrical Performance

      1.Contact Current Rating 0.5Amperes maximum per pin when mated.

      2.Voltage Rating 30VAC per contact when mated or unmated.

      3.Contact Resistance 30mohm max. initial, 15mohm maximum after stress test.