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Cool Stack 0.80mm Hybrid Power & Signal Connectors

HYBRID CONNECTOR FOR COPLANAR BOARD-TO-BOARD APPLICATIONS
Cool Stack Hybrid Power and Signal connectors bring high speed and high power into a one-piece solution while addressing multiple networking standards like PCIe, and SAS/SATA.

  • Coplanar configuration is available
  • 16Gb/s high speed performance
  • Supports multiple impedance systems
CXP

The Amphenol CXP connectors come in a one-piece press-fit assembly system with twelve channels of up to 20 Gbps, resulting in 240 Gbps of total bandwidth. This allows our CXP to go beyond the 100 Gigabit Ethernet IEEE 802.3b,a and the InfinibandCXP12x QDR standards. The CXP series is the fastest and most dense I/O on the market today. It enables pluggable copper or optical cables to increase the flexibility of system level hardware for end users, and offers reduced cross-talk. The CXP interconnect system offers plug-to-receptacle containment with the various EMI gasket and EMI spring finger options, and is ideal for network switches, routers, servers and storage devices.

D-Sub

The standard and high density D-Subminiature connectors are available in five shell sizes offering a wide choice of contact positions: 9, 15, 25, 37, and 50 in standard density and 15, 26, 44, 62, 78, and 104 positions in high density. We offer filtered, sealed and compliant tail designs as well as custom crimp type or other terminations

D-Sub Cable Connectors - Basics

Amphenol ICC's D-Subminiature connectors are part of an industry standard for applications requiring robust and reliable connectors. These proven D-Subminiature connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical. Since many years Amphenol ICC has been offering a wide range of D-Subminiature connectors to meet various design requirements including those in harsh environment.

These high performance connectors are designed for severe environment applications in the field of Telecommunications - data transmission, private automatic branch switching... Connectors for Aerospace, military (125°C) class and for particularly severe applications, especially high temperature (+155°C) class available. It features machined contacts and is available with solder bucket, straight spills, angled spills and wire wrap terminations.

D-Sub High Density Board Mount Connectors - Basics

The new High Density D-Subminiature range is part of Amphenol ICC's I/O-Connections portfolio which provides customers access to a wide range of industry standard and application specific I/O interconnect solutions. Amphenol ICC's I/O connector solutions complete your board and system designs by providing high-density and high-speed interfaces to enable interconnect technologies for networking, storage and memory and complementary products for power distribution. Our range of standardized I/O solutions enables full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI. Amphenol ICC also has the capability to provide customized I/O solutions optimized to address application specific requirements.

Through Amphenol ICC's high-speed, power, assembly and mechanical packaging expertise, you gain the advantage of getting your signals out of the box at optimal cost and performance. Amphenol ICC's I/O connectors - coupled with Amphenol ICC's extensive range of backplane and board-to-board connectors and cable assembly products-enable complete link solutions for your equipment designs.

Amphenol ICC's D-Subminiature connectors are part of an industry standard for applications requiring robust and reliable connectors. These D-Subminiature connectors are one of the most popular Input - Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. Since many years Amphenol ICC offers a wide range of D-Subminiature connectors to meet all design requirements, and to address increasing needs for high density packaging, Amphenol ICC developed the D-Subminiature High Density Range.

D-Sub Standard Board Mount Connectors - Basics

Amphenol ICC's D-Subminiature connectors are part of an industry standard for applications requiring robust and reliable connectors. These proven D-Subminiature connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer Industrial, Military, Instrumentation and Medical. Since many years Amphenol ICC has been offering a wide range of D-Subminiature connectors to meet various design requirements including those in harsh environment.

The standard density D-Subminiature series are widely used for numerous applications in many market segments. Amphenol ICC offers Delta-D (single shell design) and Frugal-D (two shell design) under this category. Standard density D-subminiature connectors available in solder bucket, straight and angled version. They come with a large number of mounting options.

DDR3

Memory module sockets from Amphenol ICC are designed to accept most industry standard memory types (DDR, DDR2, DDR3) and formfactors such as DIMM, 50-DIMM or VLP DIMM. The sockets allow convenient memory expansion in servers, workstations, desktop PCs, mobile PCs and embedded applications in communications and industrial equipment.

DDR3 memory sockets accept 240-position DDR3 memory modules as per JEDEC M0-269. Low contact resistance versions support the use of RDIMM (registered DIMM) which is becoming more and more popular in use because it helps further reducing power consumption in data communication systems such as servers.

DDR3 memory sockets from Amphenol ICC are available in various form factors including VLP (very low profile) providing an overall connector height of less than 20.8mm and comply to JEDEC 80-007 specifications.

DDR4

Vertical DDR4 DIMM sockets from Amphenol ICC provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The sockets facilitate convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment.

The low-resistance contacts also support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in datacenter hardware such as servers, storage and networking equipment. The low 2.4mm module seating plane and slim ejector designs reduce the overall profile of the connector and installed module to help optimize airflow.

Surface-mount (SMT), plated-through-hole (PTH) solder, and press-fit (PF) connector termination options are offered.

DDR4 SO-DIMM Connectors

HIGH SPEED HIGH DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260position SO-DIMM connectors are available in 4, 5.2, 8, 9.2mm height, in standard or reverse options.

  • High density design of 0.50mm pitch
  • Smaller connector saves board space
  • High speed DDR4 Digital Validation
  • Different key positions aid alignment
  • SMT mechanical hold-downs
DDR4 Ultra Low Profile

SPECIALLY DESIGNED SOCKETS FOR LOW PROFILE SYSTEM

DDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch and facilitate convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment.

Ultra low module seating height of 1.1mm

Lowest connector height of 13.1mm

Reduced overall profile of the connector

Compatible with standard DIMM module to help optimize airflow

Low resistance contacts (registered DIMM) reduces power consumption in hardware

DIN Headers & Receptacles - Basics

Amphenol ICC offers a broad and a complete range of interconnection systems conforming to DIN 41612 and IEC 603-2 specifications. DIN 41612 connector systems are the most popular backplane interconnect systems due to the widespread standard adoption, easy availability, cost-effectiveness and durability.

The product design for Board-to-Board and I/O solutions involve two popular mating combination; Standard Mount and Reverse Mount.

These connectors are available in up to three rows and 96 positions with Solder, Press-fit and Pin-in Paste terminations. Amphenol ICC offers three standard performance class options as follows: DIN class I (500 operations); DIN class II (400 operations); DIN class III (50 operations).

Primary market segments include Industrial, Telecom and Data.

DisplayPort to D-Sub(VGA) 15P

 

Features and Benefits

       Transfer Dual Mode DP(Dual Mode DisplayPort) signal to VGA signal

       Dual Mode DP(Dual Mode DisplayPort) signal enhancer

       Compliance with DP 1.1 Specification

Mechanical Performance

       Mating Force and Unmating Force

       Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

       Mating Force: 44.1 N maximum.

       Unmating Force(no latches): 9.8N(1.0kg) min,39.2N(4.0kg) max

       Product Environmental Compliance

       RoHS 2.0: RoHS 2.0 Compliant

      China RoHS: Yes

      REACH SVHC: Yes

      Low-Halogen Status: Not Reviewed

 

DisplayPort to DVI 24+1P Female

 

Features and Benefits

       1. Transfer Dual Mode DP(Dual Mode DisplayPort) signal to DVI(Digital Visual Interface)

       2. Dual Mode DP(Dual Mode DisplayPort) signal enhancer

       3. Compliance with DP Specification Rev 1.2

Mechanical Performance

       Mating Force and Unmating Force

       Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

       Mating Force: 44.1 N maximum.

       Unmating Force(no latches): 9.8N(1.0kg) min,39.2N(4.0kg) max

       Product Environmental Compliance

       RoHS 2.0: RoHS 2.0 Compliant

       China RoHS: Yes

       REACH SVHC: Yes

       Low-Halogen Status: Not Reviewed

 

DisplayPort to HDMI A Type 19P Receptacle

 

Features and Benefits

      Transfer Dual Mode DP(Dual Mode DisplayPort) signal to HDMI signal

      Dual Mode DP(Dual Mode DisplayPort) signal enhancer

      Compliance with DP 1.1 Sepecification

      Compliance with HDMI 1.4 Sepecification

Mechanical Performance

      Mating Force and Unmating Force

       1. DP plug connector

          Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

          Requirement:Mating Force: 44.1 N maximum.

          Unmating Force(no latches): 9.8N(1.0kg) min,39.2N(4.0kg) max

       2. HDMI A type receptacle

           Condition: EIA 364-13. Insert and extract at a speed of 25mm/minute.

           Requirement: Mating Force: 44.1 N maximum.

           Unmating Force: 9.8N(1.0kg) min,39.2N(4.0kg) max

 

DisplayPort to Mini DisplayPort

 

Features and Benefits

       1. Higher performance than dual link DVI, total data rate 10.8Gbps

       2. Available audio and video for multi-function monitors

       3. Embedded clock

       4. Connector enables support for DVI and HDMI via simple adapter

       5. Enables new “Direct Drive” monitor category

       6. Enable greater integration on both sides of the interface to reduce the cost of digital displays

       7. Provide scalable performance in terms of resolution, color depth, and refresh rate over fewer wires to support emerging display needs, such as scalable lanes (1-4) for direct drive LCD panel integration

       8. Auxiliary channel(1Mbps) enables new user featuresfor example as transfer channel of voice chatter, VoIP, game control and camera video

       9. Available content protection supports high definition movie viewing

      10. Enable a common interface approach across both internal and external display connections

      11. Enable an extensible, open industry standard without IP (intellectual property) barriers

      12. Offer max 3m cable at high bit rate 2.7GHz and max 15m cable at low bit rate 1.62GHz

 

Duflex™ Flex Connectors

Duflex™connectors represent a low cost and reliable solution for terminating FPC/FFC and membrane touch switches. Designed for use on a 2.54mm grid the Duflex connector combines the advantage of the well proven Dubox™ receptacle with the assembly speed of IDC (Insulation Displacement Contact) termination techniques.

Available in single and double row versions with up to 36 contacts per row.

EHPCE® Enhanced High Power Card Edge Connector - Basics

CLASSIC HPCE® WITH ENHANCED PERFORMANCE

eHPCE® connector offers a 15% increase in power density with the same footprint as classic HPCE®. The all-new power contact design offers lower contact resistance and higher current carrying capacity compared to classic HPCE® connectors. eHPCE® connectors are designed to extend the life of power supplies using card edge output power connectors.

Same mating footprint as classic HPCE®

Enhanced housing design

GCS® plated contacts deliver lower resistance without the high cost of gold

Maximum operating temperature increased to 105°C

Low-halogen housing material

eQSFP

The eQSFP interconnect system is comprised of a 38 position 0.8 mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps / Channel, and replacing up to 4 standard SFP+ receptacles. These features result in greater port density and overall cost savings over traditional SFP+ products. Supporting standards include, Gigabit Ethernet, InfiniBand, and SONET/SDH with different data rate options. eQSFP includes cages in single and ganged configurations with multiple heat sink options supporting various thermal requirements and port status with light pipes options.

ESATA 7P Plug to 7P Plug

 

Features and Benefits

      1. Transmission rate 6 Gbps.

      2. Meet SATA 3.0 specification.

Mechanical Performance

      1. Mating Force and Unmating Force

          Condition: EIA 364-13. Insert and extract at a speed of 12.5mm/minute.

          Mating Force: 40 N max.

           Unmating force: 10N Min.

       2. Durability:

           Condition: EIA 364-09. Mated and Unmated connector for 2500cycles at a rate of 500 cycles per hour.

          No physical damage and shall meet requirements of subsequent test.

 

ESATA 7P Plug to 7P Receptacle

 

Features and Benefits

      1. Transmission rate 6 Gbps.

      2. Meet SATA 3.0 specification.

Mechanical Performance

      1. Mating Force and Unmating Force

          Condition: EIA 364-13. Insert and extract at a speed of 12.5mm/minute.

          Mating Force: 40 N max.

          Unmating force: 10N Min.

      2. Durability:

          Condition: EIA 364-09. Mated and Unmated connector for 2500cycles at a rate of 500 cycles per hour.

         No physical damage and shall meet requirements of subsequent test.

 

ExaMAX® 56Gb/S High Speed Backplane Connector

SUPPORTS MANY INDUSTRY STANDARD SPECIFICATIONS; MIGRATION PATH TO HIGHER BANDWIDTH APPLICATIONS

ExaMAX® backplane connector system meets industry specifications requiring higher bandwidth applications from 25Gb/s to 56Gb/s. The optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion loss while minimizing channel performance variation for every differential pair. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s. The simple, functional design contributes to a very cost-effective solution.

The innovative beam-on-beam contact interface minimizes residual stub for improved signal integrity performance while providing exceptionally low mating forces

ExaMAX® optimizes design flexibility by integrating high speed differential signals, low speed signals and power in one connector

ExaMAX® product family is offered in industry standard packaging options including traditional backplane, coplanar board, orthogonal midplane and orthogonal direct mate, mezzanine and cable to board

ExpressPort QSFP

The ExpressPort QSFP+/QSFP interconnect system and the stacked combos are comprised of 38-position 0.8mm pitch SMT connectors, as well as press-fit cages intended for external connections. Each port offers 4 channels which increases port density and contributes to cost savings. The ExpressPort QSFP+ E-Series connector family is rated at 28 Gbps per channel. It features as tamped and formed contact design providing improved mechanical durability, an integrated grounding structure,and resonance dampening features for superior crosstalk performance. The contact design is optimized for a smooth impedance profile resulting in improved SI performance.

ExpressPort SFP

Amphenol’s ExpressPort SFP+ 1xN connector, when combined with the ExpressPort SFP+ cage, provides data transfer speeds of up to 25 Gbps. This is the highest speed in the market for the SFP+ series. The design of the ExpressPort SFP+ connector minimizes impedance discontinuities and reflections at high data rates, and provides a 10 to 20 dB improvement in Near-End Cross talk. The connectors accept multiple transceivers per SFF-8431 and are compliant with SFF-8081 and SFF-8083 speci- fications. Our unique ExpressPort SFP+ cage features enhanced EMI shielding options in the form of metal spring fingers or elastomeric gaskets. Ganged versions are compliant with the SFF-8433 standard. The ExpressPort SFP+ 2xN combos consist of an integrated stacked connector system and a cage with compliant press-fit pins or solder tail.

FFC & LIF to VGA + 2X USB3.0 A

 

Features and Benefits

       1. High speed data transmission, such as USB2.0, USB3.0, video and audio

       2. USB signal transmission speed up to 5Gbps

       3. Hybrid FFC with power , differential pair, LED and switch control signal

       4. Easy to assemble with locking latches

       5. Easy to fold and easy routing

       6. Lighter and thinner than copper cable

 

Filtered D-Sub connectors

In applications where connectors are used as an interface in shielded enclosures the plastic isolating body of connectors provide no shielding against any interference signals that may be present. In such cases high frequency interference signals can be passed in or out of the system without hindrance. Here comes the importance of Filtered connectors. It can help to maintain signal integrity and EMC protection in critical applications and thereby safeguard the function of electrical devices and systems.

The connector is constructed by combining standard D-Sub components with a filter element mounted between each contact and the ground shell. The end product having footprint dimensions similar to standard versions makes the changeover from a standard Non-Filtered connector in an existing Electronic system to filter connector simple.

Amphenol ICC's Filtered D-Sub is designed to provide a solution for EMI & RFI protection in a wide variety of applications in Telecommunication, Medical, Data, Consumer, Instrumentation and Military.

Flat Cable

LF Cable Assemblies

Flexible Busbar - Power Distribution

Flexible busbars are composed of several thin layers of copper or aluminum and are designed to efficiently distribute power across an AC or DC system. Amphenol power distribution busbars are an excellent replacement for power harness applications.

Benefits

  • Ideal for thermal expansion environments
  • Effective for tolerance mismatch applications
  • Ideal for shock and vibration environments

Features

  • Single Potential (PWR or RTN)
  • Made of multiple thin sheets of copper or aluminum
  • Welded ends
  • Shrink tubing available
Flexible Printed Circuit Assemblies

Amphenol Sincere is a one stop shop for value added flexible circuits.  We will work with your engineering team from the inception of the design through full turn-key tested circuit assemblies.  Our services include design and gerber creation, DFM reviews, full in-house assembly, and testing of final product.

  • SMT and Manual Assembly
  • Wave Soldering
  •  Circuit Finishing including structural adhesives, epoxies, conformal coating, PSA adhesive, and Poron patches
  • Passive and Active Component Testing
Flexible and Rigid-Flex Printed Circuits

Amphenol Sincere provides high quality flexible printed circuit solutions for multiple markets including, but not limited to the  Industrial, Medical, Instrumentation, and Automotive markets .  By utilizing a manufacturing center of excellence in a low cost region, we offer the customer a great value at a low cost.  Our products include:

  • Single Sided Flex - Type I
  • Double Sided Flex - Type II
  • Multilayer Flex - Type III
  • Rigid-Flex - Type IV
Front I/O cable

 

Features and Benefits

       It can provide audio output, data output/input, and multiple LEDs indicator to identify current status of the host. We can provide the fly wire panel with USB3.0

interface, USB3.0 interface have some benefits as below:

       1.Internal USB3.0 interface solution can support up to 20 positions, comparison 9 or 10 positions of external USB3.0

       2.The transmission speed can be up to 5Gbps comparison with 480Mbps of USB2.0

       3.Individual line for transmission and receiving enables higher speed data exchange

       4.USB3.0 current capability has increased to 900mA

Mechanical Performance

       1. USB Mating Force and  Unmating Force

           Condition: EIA 364-13,at a max rate of 12.5mm per minute.

            Mating Force: 35N Max.

            Unmating Force: 10N Min.    

       2. Audio Mating Force and  Unmating Force

           Condition: EIA 364-13,at a max rate of 12.5mm per minute.

          Mating Force: 4~40N

            Unmating Force:4~40N