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Amphenol® HDB³ Series High Density Mother Board & Daughter Board Connectors
Mar 11,2008 1:20 PM
Amphenol Aerospace expands its Board Level product offerings through the release of HDB3, a high density brush connector series. HDB³ utilizes the high performance brush contact system for reliability in harsh environments, excellence in vibration and shock, resistance to fretting corrosion, and durability to over 100,000 mating cycles. This new connector series offers the highest density of any brush interconnect with .070"X.060" staggered grid spacing. Optional Keys and guide pins have been combined with mounting features to reduce occupied board space.
Currently available in the following contact arrangements 40, 80, 120, 160 contacts. HDB³ is configurable for data rates up to 3.125 Gbps per 100 Ohm differential pair . RoHS compliant version also available.
Amphenol Aerospace welcomes inquiries and is offering a FREE sample of HDB³ for a limited time. Please visit www.amphenol-aerospace.com to request your FREE sample today. The Board Level Products team is continuously expanding to meet current and future customer’s needs. Feel free to contact us at the below address with any such inquiries.
Contact our Board Level Products team with any questions or inquiries – blp-marketing@amphenol-aerospace.com or call (800) 678-0141
