News Archive

Amphenol LTW Encapsulation Technology


August 8, 2011

Taipei, Taiwan (July 20, 2011) — Amphenol LTW Technology introduce customized PCB encapsulation technology via low pressure injection molding (LPIM) with shorten lead time. IP67 & IP68 with better mating seal to prevent sensitive electronic components from damaging.

Amphenol LTW LPIM Solution

Amphenol LTW LPIM Solution

For further information, please contact:
Sales & Marketing Department
Amphenol LTW Technology Co., Ltd.

E-mail: salesï¼ ltw-tech.com
URL: www.amphenolltw.com